Refurbished RTC IR Furnaces

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RTC IR Furnaces rebuilt to Customer Specifications and Options

SERIESDESCRIPTIONAPPLICATION
RTC CU-Series
High Production Semiconductor Packaging Silver Die Attach

 RTC CU-Series IR Furnace

30-60 inch long heat chamber, temperatures up to 1000C, multi-stage temperature profiles, rapid removal of volatiles with multiple intermediate exhausts, inline drying and firing, multiple atmospheres with gas barriers, clean room compatible. 3 phase 208-500 Vac, 50/60 Hz. 

Refurbished to suit customer requirements. (from $48,000)

Gold/tin sealing, brazing, flip chip reflow attachment and silver-glass die attach and similar processes requiring multi-stage temperature profiles.  Ideal for single and two stage silver-glass die attach profiles, as well as thick film products in air or nitrogen.

RTC 304 & 306 Models
Comapact Laboratory Furnaces, 4 & 6-inch belt.


LA-306 compact lab IR furnace

Compact RTC Laboratory furnaces including RA-, RF-, LA- and LF- 304 and 306 models.  30-inch long heating chamber, 3-zone furnaces with 4-inch or 6-inch belts.  These furnaces offer low cost, small footpring and low power and gas consumption.  The feature start-up often in less than 30 minutes, precise and repeatable zone temperature control, temperature profiles up to 1000C, and controlled-atmosphere capability in a compact footprint. Single phase 208, 220, 240 Vac, 50/60 Hz. Refurbished with new design control system, 12-mo factory warranty.

4"-belt from $24,500 for single gas

6"-belt from $27,500 (LA-series) for single gas (RA, LF, RF may be lower)
   -add $1500 for dual gas.

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

RTC LA-310 Model
Laboratory Furnaces
9.5-inch (240 mm) belt


RTC LA-310 IR furnace

RTC Laboratory furnaces with 9.5-inch wide belt, 30 inch heating chamber, 3-zones.  Fast eficient lab or production furnace.  LA-series furnaces offer higher production yield and throughput and feature start-up often in less than 30 minutes, precise and repeatable zone temperature control, temperature profiles up to 1000C, and controlled-atmosphere capability of <20 ppm oxygen in a compact footprint. Refurbished with new computer HMI interface and controller.  12-month factory warranty.  (from $40,000) 

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

RTC D-Series
Ovens & Dryers

RTC D-Series IR Oven

Fast eficient production furnace.  D-series dryers offer precise control at low temperatures for high yield and throughput.  Features quick start-up to Process Start, precise and repeatable zone temperature control, temperature profiles up to 400C. 


Sorry, none available at this time.

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

RTC S-Series
Seal Production Furnaces

RTC S-Series IR Furnace
RTC S-610
RTC S-915X with dryer
RTC S-915X with dryer

Fast eficient production furnace.  S-series furnaces offer high production yield and throughput and feature start-up often in less than 30 minutes, precise and repeatable zone temperature control, temperature profiles up to 1000C, and controlled-atmosphere capability of 1-5 ppm above incoming gas purity.  The S-Series Infrared Furnaces utilize high intensity heat to achieve exacting temperature profiles, with rapid heat rise and no overshoot. 3-phase, 208-500 Vac, 50/60 Hz. Rebuilt to customer requirements. 12-month factory warranty.  Call or email with requirements for quote.

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

RTC SMD-Series
Solder Reflow Systems

RTC SMD-Series IR Furnace
SMD-624 (entrance)
RTC SMD-Series IR Furnace
SMD-624 (exit view)
RTC SMD-1224 IR Furnace
SMD-1224

Fast eficient surface mount reflow production furnace.  SMD-series furnaces offer high production yield and throughput and feature start-up often in less than 30 minutes, precise and repeatable zone temperature control, temperature profiles up to 600C, and controlled-atmosphere capability of 1-5 ppm above incoming gas purity.  The SMD-Series Infrared Furnaces utilize high intensity heat to achieve exacting temperature profiles, with rapid heat rise and no overshoot. 3-phase, 208-500 Vac, 50/60 Hz.


Rebuilt to customer requirements. 


12-month factory warranty. 


Call or email with requirements for quote.

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

RTC TF-Series
Thick Film Firing Furnace

TF-Series IR Furnace

Fast eficient production furnace.  Tf-series furnaces offer high production yield and throughput and feature start-up often in less than 30 minutes, precise and repeatable zone temperature control, temperature profiles up to 1000C, and controlled-atmosphere capability of 1-5 ppm above incoming gas purity.  The S-Series Infrared Furnaces utilize high intensity heat to achieve exacting temperature profiles, with rapid heat rise and no overshoot.


Rebuilt to customer requirements.  12-month factory warranty. 

Call or email with requirements for quote.

Used for high-temperature semiconductor and thick-film processing.  The rapid heat rise of these furnaces is of particular advantage in the final lid sealing or die attach process since the semi-conductor is not exposed to prolonged high temperature. In lead frame attachment, there is no contact with the part to cause distortion in the frame. All leads remain planar which greatly facilitates subsequent automatic wire bonding steps.

Rebuilt Furnaces
New Furnaces
eMail for Quote

 

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